Standard with the one copper layer on one side of polyimide film . A single sided flexible printed circuit (FPC)construction with a polyimide cover film laminated to cover film laminated to copper allowing . One single conductive layer, either bonded between two insulating lamination or uncovered on one side. Access is each time from the top as well as double-sided access is possible.
FPC is thin and flexible and allows engineers to utilize space.
FPC reduces overall system weight. Components can be mounted directly on the FPC.
Solder Electrolytic Plating
Gold Electrolytic Plating